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General Information
    • ISSN: 2010-3689
    • Frequency: Bimonthly (2011-2014); Monthly (Since 2015)
    • DOI: 10.18178/IJIET
    • Editor-in-Chief: Prof. Dr. Steve Thatcher
    • Executive Editor: Ms. Nancy Y. Liu
    • Abstracting/ Indexing: EI (INSPEC, IET), Electronic Journals Library, Google Scholar, Crossref and ProQuest
    • E-mail: ijiet@ejournal.net
Prof. Dr. Steve Thatcher
QUniversity, Australia
It is my honor to be the editor-in-chief of IJIET. The journal publishes good-quality papers which focous on the advanced researches in the field of information and education technology. Hopefully, IJIET will become a recognized journal among the scholars in the related fields.

IJIET 2015 Vol.5(9): 645-649 ISSN: 2010-3689
DOI: 10.7763/IJIET.2015.V5.584

Reliable Random Key Pre-Distribution Schemes for Wireless Sensor Networks

Si Gwan Kim
Abstract—The development of small-size, low-cost, and low-power sensors that possess sensing, signal processing and wireless communication capabilities is becoming popular for the wireless sensor networks. Cluster-based routing protocol is a good choice to achieve the energy efficiency for the wireless sensor networks. Due to the limited resources and energy constraints, complex security algorithms cannot be employed in sensor networks. In this paper, we propose a cluster-based routing protocol with a key pre-distribution scheme which improves the resilience of the network. In addition, our scheme is suitable for link error-prone environments. We describe the details of the algorithm and compare it with other schemes. Simulation results show that the proposed scheme achieves better performance in terms of security, efficiency and key connectivity.

Index Terms—Cluster, key pre-distribution, security, wireless sensor networks.

Si Gwan Kim is with Kumoh National Institute of Technology, Gumi, Korea (e-mail: sgkim@kumoh.ac.kr).


Cite: Si Gwan Kim, "Reliable Random Key Pre-Distribution Schemes for Wireless Sensor Networks," International Journal of Information and Education Technology vol. 5, no. 9, pp. 645-649, 2015.

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