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General Information
    • ISSN: 2010-3689
    • Frequency: Bimonthly (2011-2014); Monthly (Since 2015)
    • DOI: 10.18178/IJIET
    • Editor-in-Chief: Prof. Dr. Steve Thatcher
    • Executive Editor: Ms. Nancy Y. Liu
    • Abstracting/ Indexing: EI (INSPEC, IET), Electronic Journals Library, Google Scholar, Crossref and ProQuest
    • E-mail: ijiet@ejournal.net
Editor-in-chief
Prof. Dr. Steve Thatcher
QUniversity, Australia
It is my honor to be the editor-in-chief of IJIET. The journal publishes good-quality papers which focous on the advanced researches in the field of information and education technology. Hopefully, IJIET will become a recognized journal among the scholars in the related fields.

IJIET 2013 Vol.3(5): 571-574 ISSN: 2010-3689
DOI: 10.7763/IJIET.2013.V3.337

Tacit Knowledge Transfer from Manufacturing Firms to Suppliers in New Product Development: A Study of Suppliers

Yushan Zhao
Abstract—Integrating suppliers’ knowledge and expertise in new product development becomes increasingly important for manufacturing firms’ product success. Most studies adapt the manufacturing firms’ standpoint and research the benefits of manufacturing firms in new product development. Relatively little attention has been given to the suppliers' perspective in their research. This paper studies suppliers in working partnerships with manufacturing firms in new product development. A model is proposed to study the impact of relationship strength on the tacit knowledge transfer from manufacturing firms to suppliers in new product development. It also investigates the impact of tacit knowledge transfer on supplier new product performance.

Index Terms—Supplier, tacit knowledge transfer, new product development.

Yushan Zhao is with the College of Business and Economics, University of Wisconsin-Whitewater, Whitewater, WI 53190 USA (e-mail: zhaoy@uww.edu).

[PDF]

Cite:Yushan Zhao, "Tacit Knowledge Transfer from Manufacturing Firms to Suppliers in New Product Development: A Study of Suppliers," International Journal of Information and Education Technology vol. 3, no. 5, pp. 571-574, 2013.

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