International Journal of
Information and Education Technology

Editor-In-Chief: Prof. Jon-Chao Hong
Frequency: Monthly
ISSN: 2010-3689 (Online)
E-mali: editor@ijiet.org
Publisher: IACSIT Press
 

OPEN ACCESS
3.9
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IJIET 2020 Vol.10(11): 854-858
doi: 10.18178/ijiet.2020.10.11.1470

Continuous Education through Building a Work-and-Learn Relationship: How Does the Industrial Attachment Program Work in Hong Kong

Peter ChunYu Yau , Dennis Wong , Andrew Lam

Abstract

In this paper, we reviewed the current university funding situation in Hong Kong for the past five years. We also reviewed the trend of student enrollment numbers to tertiary education in contrast to the support of the continuous education fund (CEF) for citizens. How personal development was build and how the programs were organized will be discussed. An in-depth analysis of the Industrial Attachment (IA) program (sometimes may be called internship program) was studied via three case studies, to understand the program arrangement, effectiveness, and impaction towards the sense of continuous education from the students’ perspective. The case studies we provided include former students sharing their training experience gained from working in a software development house, a financial institute, and a school respectively. Results showed that the industrial attachment program gives various positive implications to the participants in academic, career, and life-long perspectives, which life-long implication is the one affected students the most among the three.

Keywords

  • Continuous education
  • industrial attachment program
  • work and learn
  • Hong Kong
  • education
1470-L155

How to Cite

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Peter ChunYu Yau, Dennis Wong, and Andrew Lam, "Continuous Education through Building a Work-and-Learn Relationship: How Does the Industrial Attachment Program Work in Hong Kong," International Journal of Information and Education Technology, vol. 10, no. 11, pp. 854-858, 2020. https://doi.org/10.18178/ijiet.2020.10.11.1470

Copyright & License

Copyright © 2020 by the authors. This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).

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