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IJIET 2020 Vol.10(11): 854-858 ISSN: 2010-3689
doi: 10.18178/ijiet.2020.10.11.1470

Continuous Education through Building a Work-and-Learn Relationship: How Does the Industrial Attachment Program Work in Hong Kong

Peter ChunYu Yau, Dennis Wong, and Andrew Lam

Abstract—In this paper, we reviewed the current university funding situation in Hong Kong for the past five years. We also reviewed the trend of student enrollment numbers to tertiary education in contrast to the support of the continuous education fund (CEF) for citizens. How personal development was build and how the programs were organized will be discussed. An in-depth analysis of the Industrial Attachment (IA) program (sometimes may be called internship program) was studied via three case studies, to understand the program arrangement, effectiveness, and impaction towards the sense of continuous education from the students’ perspective. The case studies we provided include former students sharing their training experience gained from working in a software development house, a financial institute, and a school respectively. Results showed that the industrial attachment program gives various positive implications to the participants in academic, career, and life-long perspectives, which life-long implication is the one affected students the most among the three.

Index Terms—Continuous education, industrial attachment program, work and learn, Hong Kong, education.

P. Yau is with the School of Continuing and Professional Education, City University of Hong Kong, Hong Kong (e-mail: peter.yau@cityu.edu.hk, pyau@ieee.org). D. Wong is with SUNY Korea, Korea and Stony Brook University, USA (e-mail: dennis.wong@sunykorea.ac.kr, cwong@uoguelph.ca). A. Lam is with Clixells Research, Hong Kong (e-mail: andrewlam@clixells.com).


Cite:Peter ChunYu Yau, Dennis Wong, and Andrew Lam, "Continuous Education through Building a Work-and-Learn Relationship: How Does the Industrial Attachment Program Work in Hong Kong," International Journal of Information and Education Technology vol. 10, no. 11, pp. 854-858, 2020.

Copyright © 2020 by the authors. This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).

General Information

  • ISSN: 2010-3689 (Online)
  • Abbreviated Title: Int. J. Inf. Educ. Technol.
  • Frequency: Monthly
  • DOI: 10.18178/IJIET
  • Editor-in-Chief: Prof. Jon-Chao Hong
  • Managing Editor: Ms. Nancy Y. Liu
  • Abstracting/ Indexing: Scopus (CiteScore 2023: 2.8), INSPEC (IET), UGC-CARE List (India), CNKI, EBSCO, Google Scholar
  • E-mail: ijiet@ejournal.net


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